Samsung Electronics said on Monday that it participated in the Nvidia-led alliance with the objective of playing a crucial role in leading the 6G race powered by Artificial Intelligence (AI).
The South Korean tech giant said that it has now become one of the founding members of the AI-RAN Alliance. The group was founded during the Mobile World Congress (MWC) 2024 in Barcelona. This flagship group envisions an AI-backed next-generation wireless communication standard. Besides Samsung, the members of the group are Nvidia, SoftBank, Microsoft, and Nokia.
AI 6G alliance to work on new innovation for 6G applications
The Alliance pledges to cooperate on research and development of new technologies, and their application as 6G comes right on the horizon.
The successor of 5G, 6G is said to come commercially at the end of 2030 and several states have formed strategic partnerships for its standardization, R&D, etc. Recently, the US and its allies agreed upon 6G principles as they try to combat the growing milestones China has achieved in the revolutionary network.
In the meantime, South Korea has laid out a plan to commercially roll out the network in 2028.
“Emerging services in the 6G era will revolutionize the way people interact with technology, and AI will be an integral part of this trend”, said Charlie Zhang, Senior Vice President at Samsung Research America. “The AI-RAN Alliance will foster collaboration, drive innovation, and usher in a new era of transformation around AI and 6G networks. We believe this coalition will create new value for end users and operators through AI-based use cases and innovations”.
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The tech conglomerate added that its joining the forces reflects its undying commitment to efforts in 6G research, innovation, and building its efficiency through AI.
As part of its serious approach to AI-driven 6G approach, Samsung unveiled the world’s first 36 GB DRAM memory chip on HBM3E 12H. This super-high performance chip provides an incredible bandwidth capacity of up to 1,280 Gbps and 36 GB capacity. The use of AI requires a huge amount of memory, energy, and other resources. Samsung proved that it’s serious in the business.
“The industry’s AI service providers are increasingly requiring HBM with higher capacity, and our new HBM3E 12H product has been designed to answer that need”, said Yongcheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. “This new memory solution forms part of our drive toward developing core technologies for high-stack HBM and providing technological leadership for the high-capacity HBM market in the AI era”.